In the case of surface mount devices attached to double-sided or multilayer boards, each component pad is usually connected by a short length of track to a via which forms a link to other conducting layers, and this via is known as a fan-out via. The term fan-out via is generally also taken to include any vias that fall inside the device's footprint (under the body of the device). Some designers attempt to differentiate these vias from those that fall outside the device's footprint by referring to them as fan-in vias, but this is not an industry-standard term.

Unit qualifier (symbol = f) representing one thousandth of one millionth of one millionth, or 10^-15. For example, 3fS stands for 3 x 10^-15 seconds.

A transistor whose control, or gate, signal creates an electro-magnetic field which turns the transistor ON or OFF.

A transistor whose control, or gate, signal creates an electro-magnetic field which turns the transistor ON or OFF.

A mirror in which the reflective coating is located on the face of the mirror, and not behind it as would be the case in the mirror you look into when you shave or apply your makeup (or both depending on how liberated you are).

A transition from a logic 1 to a logic 0. Also known as a negative edge.

In the case of surface mount devices attached to double-sided or multilayer boards, each component pad is usually connected by a short length of track to a via which forms a link to other conducting layers, and this via is known as a fan-out via. The term fan-out via is generally also taken to include any vias that fall inside the device’s footprint (under the body of the device). Some designers attempt to differentiate these vias from those that fall outside the device’s footprint by referring to them as fan-in vias, but this is not an industry-standard term.

A programmable logic device which is more versatile than traditional programmable devices such as PALs and PLAs, but less versatile than an application-specific integrated circuit. Some field-programmable gate arrays use fuses such as those found in programmable logic devices, but others are based on SRAM equivalents.

An alternative, proprietary name for a field-programmable interconnect device (FPID).

A device which is used to connect logic devices together, and which can be dynamically reconfigured in the same way as standard SRAM-based FPGAs. Because each FPID may have around 1,000 pins, only a few such devices are typically required on a circuit board.

A memory device in which data is read out in the same order that it was written in.

Refers to programs, or sequences of instructions, that are hard-coded into non-volatile memory devices.

A memory device in which data is read out in the same order that it was written in.

An evolutionary technology that combines the best features of the EPROM and E2PROM technologies. The name FLASH is derived from the technology's fast reprogramming time compared to EPROM.

A specialist circuit board technology, often abbreviated to "flex", in which tracks are printed onto flexible materials. There are a number of flavors of flex, including static flex, dynamic flex, and rigid flex.

A specialist circuit board technology, often abbreviated to "flex", in which tracks are printed onto flexible materials. There are a number of flavors of flex, including static flex, dynamic flex, and rigid flex.

A generic name for processes in which unpackaged integrated circuits are mounted directly onto a substrate with their component-sides facing the substrate.

A combination of flipped chip and tape automated bonding.

The area occupied by a device mounted on a substrate.

A specialist circuit board technology, often abbreviated to "flex", in which tracks are printed onto flexible materials. There are a number of flavors of flex, including static flex, dynamic flex, and rigid flex.

A programmable logic device which is more versatile than traditional programmable devices such as PALs and PLAs, but less versatile than an application-specific integrated circuit. Some field-programmable gate arrays use fuses such as those found in programmable logic devices, but others are based on SRAM equivalents.

An alternative, proprietary name for a FPID (field-programmable interconnect device).

A device which is used to connect logic devices together, and which can be dynamically reconfigured in the same way as standard SRAM-based FPGAs. Because each FPID may have around 1,000 pins, only a few such devices are typically required on a circuit board.

The most commonly used insulating base material for circuit boards. FR4 is made from woven glass fibers which are bonded together with an epoxy. The board is cured using a combination of temperature and pressure which causes the glass fibers to melt and bond together, thereby giving the board strength and rigidity. The first two characters stand for "Flame Retardant". FR4 is technically a form of fiberglass, and some people do refer to these composites as fiberglass boards or fiberglass substrates, but not often.

A form of optical interconnect in which laser-diode transmitters communicate directly with photo-transistor receivers without employing optical fibers or optical waveguides.

An application-specific integrated circuit in which the designer has complete control over every mask layer used to fabricate the device. The manufacturer does not provide a cell library or pre-fabricate any components on the substrate.

Refers to the fact that, at any given time, only a portion of the logic functions in a device or system are typically active (doing anything useful).

A test strategy in which signals are applied to a circuit's inputs, and the resulting signals which are observed on the circuit's outputs are compared to known good values.

A programmable logic device technology which employs links called fuses. Individual fuses can be removed by applying pulses of relatively high voltage and current to the device's inputs.

A programmable logic device technology which employs links called fuses. Individual fuses can be removed by applying pulses of relatively high voltage and current to the device's inputs.

A small ball of fibrous gold used in one technique for attaching components such as multichip modules to circuit boards. Fuzz-buttons are inserted between the pads on the base of the package and their corresponding pads on the board. When the package is forced against the board, the fuzz-buttons compress to form good electrical connections. Even when the pressure is removed, the fuzz-buttons act in a similar manner to Velcro and continue to hold the component in place. One of the main advantages of the fuzz-button approach is that it allows broken devices to be quickly removed and replaced. Even though fuzz-button technology would appear to be inherently unreliable, it is used in such devices as missiles, so one can only assume that it is fairly robust.

Glossary: A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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